EVG®6200 BA

The EVG®6200∞ BA bond alignment system delivers high precision, flexibility, and ease of use, making it ideal for a wide range of production environments. With exceptional accuracy, the system supports the most demanding alignment processes in MEMS production, as well as emerging fields like 3D integration applications.

Features

• Suitable for all EVG 200 mm bond systems
• Supports bond alignment of double or triple wafer stacks up to 200 mm wafer sizes
• Manual or motorized alignment stage with automatic alignment option
• Fully motorized high-resolution bottom-side microscopes
• Windows® based user interface
• Options
• Automatic alignment IR alignment for inner substrate key alignment
• NanoAlign® package for enhanced process capabilities
• Available with system rack
• Upgrade possibility to mask aligner